Jig design and manufacturing for adhesive thickness control in adhesive joints
DOI:
https://doi.org/10.5281/zenodo.7472057Keywords:
Adhesive bonding process, adhesive, bond line thickness, jig design, PLA plus materialAbstract
Adhesives and adhesive bonding is a material group and joining technique with a long history. There are many parameters that affect performance in the bonded joints. Factors such as the type of adhesive, the force applied to the joints, the shape of the joint, the surface preparations, the material to have adhered, the working conditions, and the adhesive thickness change the characteristics of the process (adhesion). Researchers use different methods to keep or change the adhesive thickness. In this study, an apparatus was designed and manufactured, which allows for keeping the adhesive thickness constant during sample preparation by focusing on the adhesive thickness in single lap joints. As a result of the tests, it was determined that the adhesive thickness was 0.2 mm in the joints obtained using this apparatus.